Model of a closed heat-conducting interface crack in a bimaterial under thermo-mechanical load

Keywords

thermoelasticity, bimaterial, closed interface crack, thermal conductivity, contact pressure of crack faces.

Cite as

Serednytska Kh. I. Model of a closed heat-conducting interface crack in a bimaterial under thermo-mechanical load. Physicochemical Mechanics of Materials. 2026. 62(1), 106-111.

https://doi.org/10.15407/pcmm2026.01.106

Abstract

A plane problem of thermoelasticity for a bimaterial with an interface heat-conducting closed crack under the action of a uniform heat flow and a compressive load is considered. A non-ideal thermal contact occurs between the crack surfaces and a thermal conductivity proportional to the contact pressure of the crack faces. The formulated problem is reduced to a singular integro-differential equation for the temperature jump and an equation for the contact pressure. An iterative procedure for solving the obtained equations is developed. A numerical analysis of the contact pressure and temperature jump between the crack faces for the bimaterial, composed of a nickel alloy and stainless steel is performed.

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